3D IC Devices, Technologies, and Manufacturing

Released on by Hong Xiao
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  • 3D IC Devices, Technologies, and Manufacturing Book Detail

  • Author : Hong Xiao
  • Release Date : 2016-04
  • Publisher : Spie Society of Photo-Optical Instrumentation Engineers (Spie
  • Genre : Three-dimensional integrated circuits
  • Pages : 220
  • ISBN 13 : 9781510601468
  • File Size : 25,25 MB
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3D IC Devices, Technologies, and Manufacturing by Hong Xiao PDF Summary

Book Description: This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.

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Wafer Level 3-D ICs Process Technology

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa

Three Dimensional System Integration

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as

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3D Integration in VLSI Circuits

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int