3D IC Integration and Packaging PDF book is popular Technology & Engineering book written by John H. Lau. The book was released by McGraw Hill Professional on 2015-07-06 with total hardcover pages 481. Fast download link is given in this page, you could read 3D IC Integration and Packaging by John H. Lau in PDF, epub and kindle directly from your devices.
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as
