3D Integration for VLSI Systems

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  • 3D Integration for VLSI Systems Book Detail

  • Author : Chuan Seng Tan
  • Release Date : 2016-04-19
  • Publisher : CRC Press
  • Genre : Science
  • Pages : 376
  • ISBN 13 : 9814303828
  • File Size : 1,1 MB

3D Integration for VLSI Systems by Chuan Seng Tan PDF Summary

Book Description: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

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3D Integration for VLSI Systems

3D Integration for VLSI Systems

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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling

3D Integration in VLSI Circuits

3D Integration in VLSI Circuits

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int

3D Integration in VLSI Circuits

3D Integration in VLSI Circuits

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int

3D Integration in VLSI Circuits

3D Integration in VLSI Circuits

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int