Area Array Package Design PDF book is popular Technology & Engineering book written by Ken Gilleo. The book was released by McGraw-Hill Professional Publishing on 2004 with total hardcover pages 232. Fast download link is given in this page, you could read Area Array Package Design by Ken Gilleo in PDF, epub and kindle directly from your devices.
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-
