Chemical-Mechanical Planarization of Semiconductor Materials

Released on by M.R. Oliver
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  • Chemical-Mechanical Planarization of Semiconductor Materials Book Detail

  • Author : M.R. Oliver
  • Release Date : 2004-01-26
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Pages : 444
  • ISBN 13 : 9783540431817
  • File Size : 33,33 MB
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Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver PDF Summary

Book Description: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

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