Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System

Released on by Seiji Samukawa
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  • Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System Book Detail

  • Author : Seiji Samukawa
  • Release Date : 2014-01-28
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Pages : 46
  • ISBN 13 : 4431547959
  • File Size : 66,66 MB
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Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System by Seiji Samukawa PDF Summary

Book Description: This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.

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Plasma Processing of Materials

Plasma Processing of Materials

File Size : 58,58 MB
Total View : 6965 Views
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Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive,