Integrated Circuit Packaging, Assembly and Interconnections

Released on by William Greig
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  • Integrated Circuit Packaging, Assembly and Interconnections Book Detail

  • Author : William Greig
  • Release Date : 2007-04-24
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Pages : 312
  • ISBN 13 : 0387339132
  • File Size : 27,27 MB
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Integrated Circuit Packaging, Assembly and Interconnections by William Greig PDF Summary

Book Description: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

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Semiconductor Packaging

Semiconductor Packaging

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semic