Materials for Advanced Packaging

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have

Semiconductor Advanced Packaging

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and

Advanced Materials for Thermal Management of Electronic Packaging

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in

Bio-based Materials for Food Packaging

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This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respectiv

Advanced Flip Chip Packaging

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro