Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335

Released on by Mikhail R. Baklanov
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  • Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335 Book Detail

  • Author : Mikhail R. Baklanov
  • Release Date : 2011-11-21
  • Publisher : Materials Research Society
  • Genre : Technology & Engineering
  • Pages : 0
  • ISBN 13 : 9781605113128
  • File Size : 27,27 MB
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Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335 by Mikhail R. Baklanov PDF Summary

Book Description: This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.

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Materials for Advanced Packaging

Materials for Advanced Packaging

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have