Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

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  • Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 Book Detail

  • Author : Qinghuang Lin
  • Release Date : 2007-09-12
  • Publisher :
  • Genre : Science
  • Pages : 366
  • ISBN 13 :
  • File Size : 5,5 MB

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 by Qinghuang Lin PDF Summary

Book Description: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

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