Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Released on by Hengyun Zhang
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  • Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore Book Detail

  • Author : Hengyun Zhang
  • Release Date : 2019-11-14
  • Publisher : Woodhead Publishing
  • Genre : Technology & Engineering
  • Pages : 436
  • ISBN 13 : 0081025335
  • File Size : 25,25 MB
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by Hengyun Zhang PDF Summary

Book Description: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

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