Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Released on by Sung Kyu Lim
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  • Design for High Performance, Low Power, and Reliable 3D Integrated Circuits Book Detail

  • Author : Sung Kyu Lim
  • Release Date : 2012-11-27
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Pages : 573
  • ISBN 13 : 1441995420
  • File Size : 33,33 MB
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim PDF Summary

Book Description: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

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Die-stacking Architecture

Die-stacking Architecture

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The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the