RF and Microwave Microelectronics Packaging

Released on by Ken Kuang
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  • RF and Microwave Microelectronics Packaging Book Detail

  • Author : Ken Kuang
  • Release Date : 2009-12-01
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Pages : 295
  • ISBN 13 : 1441909842
  • File Size : 89,89 MB
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RF and Microwave Microelectronics Packaging by Ken Kuang PDF Summary

Book Description: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers