Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging PDF book is popular Juvenile Nonfiction book written by John Lau. The book was released by Springer on 1993-08-05 with total hardcover pages 920. Fast download link is given in this page, you could read Thermal Stress and Strain in Microelectronics Packaging by John Lau in PDF, epub and kindle directly from your devices.
Thermal Stress and Strain in Microelectronics Packaging
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Thermal Stress and Strain in Microelectronics Packaging Book Detail
- Author : John Lau
- Release Date : 1993-08-05
- Publisher : Springer
- Genre : Juvenile Nonfiction
- Pages : 920
- ISBN 13 :
- File Size : 70,70 MB