Area Array Packaging Materials

Released on by Ken Gilleo
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  • Area Array Packaging Materials Book Detail

  • Author : Ken Gilleo
  • Release Date : 2004
  • Publisher : McGraw Hill Professional
  • Genre : Ball grid array technology
  • Pages : 182
  • ISBN 13 : 9780071428286
  • File Size : 26,26 MB
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Area Array Packaging Materials by Ken Gilleo PDF Summary

Book Description: This engineering reference covers the most important assembly processes in modern electronic packaging.

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Area Array Packaging Handbook

Area Array Packaging Handbook

File Size : 36,36 MB
Total View : 5312 Views
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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C

Area Array Interconnection Handbook

Area Array Interconnection Handbook

File Size : 25,25 MB
Total View : 7202 Views
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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third

Area Array Packaging Processes

Area Array Packaging Processes

File Size : 13,13 MB
Total View : 4899 Views
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This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach