Area Array Packaging Handbook

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  • Area Array Packaging Handbook Book Detail

  • Author : Ken Gilleo
  • Release Date : 2002
  • Publisher : McGraw Hill Professional
  • Genre : Business & Economics
  • Pages : 832
  • ISBN 13 :
  • File Size : 77,77 MB

Area Array Packaging Handbook by Ken Gilleo PDF Summary

Book Description: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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