Through-Silicon Vias for 3D Integration
Through-Silicon Vias for 3D Integration PDF book is popular Technology & Engineering book written by John H. Lau. The book was released by McGraw Hill Professional on 2012-08-05 with total hardcover pages 513. Fast download link is given in this page, you could read Through-Silicon Vias for 3D Integration by John H. Lau in PDF, epub and kindle directly from your devices.
Through-Silicon Vias for 3D Integration
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Through-Silicon Vias for 3D Integration Book Detail
- Author : John H. Lau
- Release Date : 2012-08-05
- Publisher : McGraw Hill Professional
- Genre : Technology & Engineering
- Pages : 513
- ISBN 13 : 0071785159
- File Size : 61,61 MB